Percolation of gallium dominates the electrical resistance of focused ion beam deposited metals

Reduced electrical impedance of SiO2, deposited through focused ion beam based systems, due to impurity percolation

Focused ion beam induced deposition: fabrication of three-dimensional microstructures and Young’s modulus of the deposited material

In this work, some of the possibilities of focused ion beams for applications in microsystem technology are explored. Unlike most previous studies, the emphasis is on ‘additive’ techniques, i.e. localized maskless deposition of metals and insulators. More precisely, we will show the possibility of fabricating small three-dimensional structures, using focused ion beam deposition of silicon oxide...

Effect of Gas Ratio on Tribological and Corrosion Properties of Ion Beam Sputter Deposited TiN Coatings

Titanium nitride thin films were grown on 304 stainless steel substrates at various nitrogen/argon flow ratios by ion beam sputtering (IBS) technique. The current research is a follow up study on the influence of gas ratio on structural and corrosion properties in the TiN coated 304 stainless steel. Film structural identification of phases was performed using X-ray diffractometry (XRD). Sca...

Disorder effects in focused-ion-beam-deposited Pt contacts on GaN nanowires.

The current-bias (I-V) characteristics at various temperatures, T, of focused-ion-beam (FIB)-deposited Pt contacts on GaN nanowires evolves from low-resistance ohmic (linear I-V) to rectifying as the diameter increases, and both exhibit strongly nonmetallic T-dependence. The small-diameter (66 nm) T-dependent resistance is explained by two-dimensional variable range hopping with a small charact...

The Origin of Background Plating

In the last years efforts were made to overcome the widespread screen printing metallization technique to reduce shading of the front side, increase the finger conductivity, and improve the contact properties of the metallization of crystalline silicon solar cells. A promising approach is plating via wet chemical metal deposition. Hereby, the metals nickel as contact layer and copper or silver ...